SPOC - Scalable Packaging for All-Optical CV Quantum Computing
Motivation
Quantum computing promises breakthroughs beyond classical limits, but faces fundamental and technical challenges in coherence, error tolerance, and scalability. Purely optical continuous-variable approaches offer a promising path. To make them feasible, scalable integration, control, and packaging of diverse quantum components are essential. SPOC addresses this gap with a multidisciplinary approach.
Implementation & Objectives
SPOC develops and validates core technologies for hybrid integration, packaging, and control of quantum photonic components. Akhetonics designs the scalable CV-MBQC architecture and photonic circuits, while Fraunhofer IZM advances packaging via optical interconnects and interposer platforms. Together, they combine nonlinear devices and interconnects into robust, coherent, and scalable quantum modules. Demonstrators will validate performance, paving the way for modular and energy-efficient photonic quantum systems.
Perspectives
The SPOC project positions its partners as leaders in scalable hybrid quantum integration. The modular architecture supports stepwise system growth, lowers entry costs, and enhances energy efficiency. Successful outcomes may drive commercialization through collaborations, licensing, and partnerships, strengthening Europe’s competitiveness in quantum technologies.
Consortium:
- Akhetonics GmbH (Projektkoordinator)
- Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM)
Contact: Stefan Bokelmann, Wojciech Lewoczko-Adamczyk
Duration: 07/2024 – 12/2026